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Real cut 1d crack
sample preparation consisting of the lpcvd deposition of a si3n4 film of 7001100nm in thickness on a si wafer with optional predefined patterns etched into the substrate prior to film deposition. (a) a channel-like nanostructures easily built using cracking induced by indentation. control is achieved through the manual manipulation of a sufficiently hard indenting implement. (b) direction control of cracking in the indentation process. (c) nanostructure fabrication using indentation on a prepatterned platform to write the letters, kist. bright structures in the figure are crack-stop structures which have been prepatterned to arrest propagating cracks and this particular platform design is intended to generate complicated nanopatterns with a freedom similar to the seven-segment displays used in the field of electronics. the thickness of the si3n4 film in the left half of the image is 700nm and that of right half is 800nm. the nanopatterns for each half are approximately 20 and 25nm in width, respectively and tens of millimeters in length.